EMC / EMI testing
Electromagnetic compatibility and emissions testing conducted in-house.
Capabilities
How we build it, and how we guarantee it.
Eight SMT assembly lines, a ten-stage QA pipeline, full MES traceability and an in-house test lab — the substance behind every circuit board assembly we ship.
The facility
A production line built to run at scale.
Eight high-speed full-auto SMT lines (Panasonic/NPM), two wave-solder lines, five assembly lines, and two conformal-coating/UV lines with automatic spray application and automatic depaneling by milling-cutter router. Inline inspection includes SPI, AOI, X-ray, ICT, FCT, first-article (FAI) and RoHS testing.
8 SMT linesPanasonic/NPM high-speed full-auto
2 wave-solder linesDual-wave, nitrogen capable
5 assembly linesSMT + THT, box build and system integration
2 conformal-coating / UV linesSelective coating and UV curing
200+ staffAcross production, QA and engineering
SPI · AOI · X-rayInline inspection at every stage
Since 2020In continuous operation
Confirmed production data
The operating numbers behind the line.
Current figures supplied by the production team. Lead times depend on design readiness, material availability and the agreed test plan.
<500 PPMDefective parts per million (DPPM)
>98%First-pass yield
<30 minTypical line-change downtime
5–7 daysTypical prototyping window
7–10 daysTypical production after materials are ready
From 1 pieceMinimum order quantity
QA pipeline
Ten checkpoints. Nothing ships until each one passes.
A disciplined build sequence from incoming goods to outgoing dispatch — every stage documented, not assumed.
01
Incoming inspection (IQC)
Every component batch is received, identified and verified against the BOM before it touches the production floor: resistors are tested for value on bridge-type equipment, chips get a microscope check plus a functional pass on dedicated test fixtures, and modules, diodes and transistors are checked against original-factory inspection reports. Reels are uniquely coded in the MES at this stage.
02
Solder-paste inspection (SPI)
Eight SPI units run inline, checking solder paste after printing. Paste volume, offset and coverage are measured on every pad; boards that fall outside tolerance are held before component placement begins.
03
Automated optical inspection (AOI)
Eight AOI units — including two dedicated 3D units — cover solder-paste and post-placement inspection, scanning the full SMT panel for missing parts, polarity errors and solder-joint defects. Results are logged to the MES before the board enters reflow.
04
Post-reflow inspection & AI material check
Boards run through Heller (13-zone) and JT (10-zone) reflow ovens, with nitrogen reflow available and support down to 01005 passives and BGA/QFN packages. After reflow, boards are re-inspected, and an AI material-change check cross-references every feeder lane against the MES — if the loaded component does not match the BOM, the line stops before the next board runs.
05
X-ray inspection
X-ray runs through SMT and DIP stages for BGA void inspection and other hidden-joint packages like QFN. Solder-ball formation and void levels are verified where visual inspection cannot reach.
06
SMT line quality checkpoint (SMT-LQC)
A dedicated hold point at the SMT stage boundary — reflow oven temperature profiles are verified every shift and at every line changeover, and moisture-sensitive components are vacuum-packed with shelf-life tracked. The build cannot advance until SMT-LQC sign-off is recorded in the MES — the check is mandatory, not assumed.
07
DIP line quality checkpoint (DIP-LQC)
The equivalent mandatory gate for through-hole assembly. Any reworked board is logged under a documented repair code and gets a second inspection pass before it moves on; every board holds at DIP-LQC until the check is clean.
08
Visual inspection & functional test
Full visual inspection of the assembled board, then in-circuit test (ICT) and functional test (FCT) fixtures run to your specification. Faults surface here, on our bench, not yours.
09
Outgoing quality assurance (OQA)
A final documented quality gate: test records, inspection notes and first-article sign-off are gathered before packing begins. Any customer complaint after delivery runs through a documented 8D process.
10
Dispatch
Boards packed ESD-safe for international shipment and sent against a confirmed delivery date, each carrying a unique traceability code. Shipment reports can be pulled in one click, so the build remains auditable after it leaves us.
MES traceability
Every board traceable to its parts and batch.
Our Manufacturing Execution System tracks the build at component level, from goods-in to dispatch. Every reel is uniquely coded, scanned and database-matched before it reaches the line; every feeder lane is verified in the MES before each run begins. QR codes and turnover-box indexing link each board to its batch throughout production. A real-time kanban shows line efficiency, capacity and first-pass yield — live, not retrospective. Wrong-material prevention is enforced by the system: no reel goes on the line without a database match — a wrong part stops the line instead of reaching your board.
- Lot-level traceability for components and consumables
- Serial-level data capture across all key processes
- Real-time dashboards and SPC for stable quality
- Digital work instructions and E-SOPs on each line
Components
SMT Process
Inspection
Test Results
Packaging
Shipment
Test & reliability lab
In-house testing, not outsourced.
The test equipment sits in the same building as the production lines. Checks happen when they should — not whenever a third-party lab has a slot.
Electrical safety testing
Dielectric withstand voltage, ground continuity and insulation resistance — verified before shipment.
Load & reliability testing
Extended load runs and stress testing to validate that design margins hold under real operating conditions.
Component & environmental testing
Incoming component verification; constant-temperature and humidity chamber; oscilloscopes and precision measurement equipment on-site.
Certifications
Built in a certified facility.
Every Faradine board is built in an IATF 16949 / ISO 9001-certified facility. The same facility holds ISO 14001 and ISO 45001 certification and is recognised as a national high-tech enterprise.
Want to verify the quality before you order?
Send your files or your questions. A project manager will walk you through the process — and, where we can, share test records from comparable builds.